Flexible, low-viscosity polyamide offering extended pot life for improved processing window.
Excellent adhesion to metals, concrete, and composite substrates without surface priming.
Good chemical resistance, particularly to alkalis, solvents, and mild acids in cured epoxy systems.
Low exotherm during cure, enabling thick-section casting and reduced thermal stress.
Compliant with REACH and RoHS directives for sustainable industrial use.
Structural adhesive formulations for aerospace and automotive bonding.
High-performance protective coatings for marine and offshore infrastructure.
Electrical encapsulants and potting compounds requiring thermal stability and dielectric integrity.
Flooring and grouting systems in industrial and pharmaceutical cleanroom environments.
Repair mortars and polymer-modified concrete overlays.
| Chemical Type | Polyamide amine adduct |
| Product Form | Liquid |
| Appearance | Amber to light brown viscous liquid |
| Primary Applications | Epoxy resin curing agent for adhesives, coatings, and composites |
| Key Features | Low viscosity, flexible cure, ambient-temperature reactivity |
| Benefits | Improved wetting, reduced mixing energy, enhanced impact resistance |
| Storage Conditions | Store in original container at 15–25°C; protect from moisture and freezing |
| Shelf Life | 12 months from date of manufacture under recommended storage |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China