English
Español
tiếng việt
русский
Flexible, low-viscosity polyamide offering extended pot life for improved processing window.
Excellent adhesion to metals, concrete, and composite substrates without surface priming.
Good chemical resistance, particularly to alkalis, solvents, and mild acids in cured epoxy systems.
Low exotherm during cure, enabling thick-section casting and reduced thermal stress.
Compliant with REACH and RoHS directives for sustainable industrial use.
Structural adhesive formulations for aerospace and automotive bonding.
High-performance protective coatings for marine and offshore infrastructure.
Electrical encapsulants and potting compounds requiring thermal stability and dielectric integrity.
Flooring and grouting systems in industrial and pharmaceutical cleanroom environments.
Repair mortars and polymer-modified concrete overlays.
| Chemical Type | Polyamide amine adduct |
| Product Form | Liquid |
| Appearance | Amber to light brown viscous liquid |
| Primary Applications | Epoxy resin curing agent for adhesives, coatings, and composites |
| Key Features | Low viscosity, flexible cure, ambient-temperature reactivity |
| Benefits | Improved wetting, reduced mixing energy, enhanced impact resistance |
| Storage Conditions | Store in original container at 15–25°C; protect from moisture and freezing |
| Shelf Life | 12 months from date of manufacture under recommended storage |
Q1: What is the primary function of EPIKURE 3175 in epoxy systems?
A: EPIKURE 3175 is a polyamide-based curing agent designed to react with epoxy resins, enabling crosslinking and development of mechanical strength, chemical resistance, and thermal stability in the cured network.
Q2: Is EPIKURE 3175 suitable for ambient-cure applications?
A: Yes — it is formulated to provide effective cure at room temperature, making it well-suited for coatings, adhesives, and repair compounds where elevated oven temperatures are impractical or undesirable.
Q3: How does EPIKURE 3175 compare to aliphatic amine curing agents in terms of handling and safety?
A: As a polyamide derivative, EPIKURE 3175 offers lower volatility and reduced skin sensitization potential compared to many low-molecular-weight aliphatic amines, contributing to improved workplace safety and easier handling during formulation and application.
Q4: Can EPIKURE 3175 be used in high-solids or solvent-free epoxy formulations?
A: Yes — its viscosity and reactivity profile support compatibility with high-solids and 100% solids epoxy systems, enabling formulators to meet VOC reduction goals without compromising cure performance or final film properties.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
