Waterborne polyamide-based curing agent enabling low-VOC, high-performance epoxy coatings.
Excellent compatibility with waterborne epoxy resins for stable dispersions and reduced film defects.
Offers balanced pot life and rapid ambient-cure development, supporting efficient production throughput.
Delivers superior adhesion to steel, concrete, and galvanized substrates without primer.
Low color and high clarity support formulation of light-colored and transparent epoxy systems.
Industrial maintenance coatings for steel structures and offshore platforms.
Waterborne epoxy primers and mid-coats in automotive OEM and refinish applications.
High-solids and low-VOC floor coatings for commercial and institutional facilities.
Concrete repair and protective lining systems in wastewater and potable water infrastructure.
Electrical insulation coatings for transformers and busbar assemblies.
| Chemical Type | Waterborne polyamide adduct |
| Product Form | Liquid dispersion |
| Appearance | Off-white to light tan, homogeneous liquid |
| pH (10% aqueous solution) | 8.0 – 9.5 |
| Solids Content (wt%) | 58 – 62 |
| Viscosity (mPa·s, Brookfield RVT, #3 spindle, 20 rpm, 25°C) | 800 – 1,500 |
| Density (g/cm³, 25°C) | 1.02 – 1.06 |
| Free Amine Value (mg KOH/g) | 140 – 170 |
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E-mail: wangxingqiang@ericwchem.com
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