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High thermal stability with glass transition temperature (Tg) up to 180 °C after full cure.
Excellent chemical resistance to acids, alkalis, and common solvents in cured form.
Low viscosity (8,000–12,000 cP at 25 °C) enabling easy processing and superior wetting of reinforcements.
Outstanding electrical insulation properties, including high dielectric strength (>20 kV/mm) and volume resistivity (>1 × 10¹⁴ Ω·cm).
Formulated for extended pot life (≥6 hours at 25 °C) without compromising final mechanical performance.
High-reliability encapsulation of power electronics and IGBT modules.
Structural bonding and potting in aerospace avionics housings.
Insulating coatings for high-voltage busbars and transformer components.
Matrix resin for carbon fiber composites in demanding industrial tooling.
Casting and impregnation of high-performance electromagnetic shielding assemblies.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) based epoxy resin |
| Product Form | Clear to pale amber viscous liquid |
| Appearance | Homogeneous, low-gel, particle-free liquid |
| Epoxide Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25 °C) | 9,500–11,500 cP |
| Volatiles Content | <0.3 wt% |
| Chloride Content | <500 ppm |
| Storage Stability | 12 months at ≤25 °C in unopened original container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
