Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Huntsman ED-2003 Polyetheramine Curing Agent

Huntsman’s ED-2003 is a low-viscosity aliphatic polyetheramine curing agent from the Versamine® series, designed for rapid-cure epoxy systems. It delivers excellent flexibility, adhesion, and chemical resistance—ideal for composites, coatings, and adhesives requiring fast turnaround and high performance under ambient or mild heat conditions.
  • huntsman ed 2003 polyetheramine curing agent_4222e296
  • huntsman ed 2003 polyetheramine curing agent_4222e296

Features Of Huntsman ED-2003 Polyetheramine Curing Agent

  1. Low-viscosity liquid enabling excellent processability and easy handling in epoxy formulation systems.

  2. Fast-reacting polyetheramine chemistry delivering rapid gel time and accelerated cure at ambient temperatures.

  3. Provides superior flexibility and impact resistance in cured epoxy networks without compromising chemical resistance.

  4. Low volatility and minimal odor support safer workplace environments and compliance with industrial hygiene standards.

  5. Compatible with standard diglycidyl ether of bisphenol A (DGEBA) and other common epoxy resins.

Typical Applications Of Huntsman ED-2003 Polyetheramine Curing Agent

  1. Structural adhesives for aerospace, automotive, and rail assembly.

  2. High-performance protective coatings for marine, offshore, and industrial infrastructure.

  3. Electrical encapsulants and potting compounds requiring fast turnaround and thermal stability.

  4. Wind turbine blade bonding and composite repair formulations.

  5. Concrete repair mortars and high-strength grouts in civil engineering applications.

Specifications Of Huntsman ED-2003 Polyetheramine Curing Agent

Chemical TypeAliphatic polyetheramine (primary/secondary amine blend)
Product FormClear to pale yellow liquid
AppearanceHomogeneous, free from visible particles or haze
Amine Value190–210 mg KOH/g
Viscosity (25°C)150–250 cP
Active Hydrogen Equivalent Weight48–52 g/eq
Primary ApplicationsEpoxy resin curing agent for structural adhesives, coatings, and composites
Key FeaturesAmbient-cure capability, low viscosity, flexible cured film, low volatility


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