Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Huntsman ED-900 Polyetheramine Curing Agent

Huntsman ED-900 is a high-performance polyetheramine curing agent from the Versamine® series, engineered for epoxy resins in demanding composites, wind blades, and aerospace applications. It delivers rapid cure kinetics, excellent toughness, low viscosity, and superior moisture resistance—enabling efficient processing and durable, high-strength thermosets.
  • huntsman ed 900 polyetheramine curing agent_2786676f
  • huntsman ed 900 polyetheramine curing agent_2786676f

Features Of Huntsman ED-900 Polyetheramine Curing Agent

  1. Low-viscosity liquid enabling excellent processability and easy handling in epoxy formulations.

  2. Fast-reacting polyetheramine chemistry delivering rapid cure at ambient and elevated temperatures.

  3. Provides outstanding flexibility, impact resistance, and toughness in cured epoxy systems.

  4. Excellent compatibility with standard diglycidyl ether of bisphenol-A (DGEBA) and novolac epoxies.

  5. Low volatility and low odor profile supporting safer industrial handling and improved workplace environment.

Typical Applications Of Huntsman ED-900 Polyetheramine Curing Agent

  1. High-performance structural adhesives for aerospace and transportation bonding.

  2. Industrial flooring systems requiring rapid return-to-service and chemical resistance.

  3. Composite matrix resins for wind turbine blades and lightweight automotive parts.

  4. Epoxy grouts and mortars used in infrastructure repair and concrete rehabilitation.

  5. Electrical encapsulation and potting compounds demanding low exotherm and dimensional stability.

Specifications Of Huntsman ED-900 Polyetheramine Curing Agent

Chemical TypePolyetheramine (tertiary amine-terminated)
Product FormClear, low-viscosity liquid
AppearanceColorless to pale yellow, transparent
Amine Value220–240 mg KOH/g
Viscosity (25°C)150–250 cP
Specific Gravity (25°C)0.95–0.98 g/cm³
Reactivity ProfileFast-curing at room temperature; accelerated at 60–80°C
Primary ApplicationsEpoxy adhesive, coating, composite, and grout formulations


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