Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Huntsman Epoxy Polyamide Curing Agent Solution Aradur 30XWM55

Huntsman Aradur 30XWM55 is a solvent-based polyamide epoxy curing agent solution offering excellent flexibility, adhesion, and chemical resistance for industrial coatings and composites. Designed for ambient-cure applications, it delivers balanced pot life and rapid film formation while maintaining low viscosity and good compatibility with standard epoxy resins.
  • huntsman epoxy polyamide curing agent solution aradur 30xwm55_e83362d2
  • huntsman epoxy polyamide curing agent solution aradur 30xwm55_e83362d2

Features Of Huntsman Epoxy Polyamide Curing Agent Solution Aradur 30XWM55

  1. Low-viscosity liquid formulation enabling easy handling and uniform mixing with epoxy resins.

  2. Flexible cure profile with good reactivity at ambient temperatures and enhanced performance upon mild heat post-cure.

  3. Excellent chemical resistance, particularly to alkalis, solvents, and industrial cleaning agents.

  4. Provides superior adhesion to steel, concrete, and other substrates in demanding industrial environments.

  5. Low odor and reduced amine blush tendency compared to conventional polyamide curing agents.

Typical Applications Of Huntsman Epoxy Polyamide Curing Agent Solution Aradur 30XWM55

  1. Industrial flooring systems for warehouses, manufacturing facilities, and pharmaceutical cleanrooms.

  2. Protective coatings for steel infrastructure including bridges, pipelines, and offshore platforms.

  3. Concrete repair mortars and high-performance grouts requiring rapid strength development.

  4. Marine coatings for ballast tanks, cargo holds, and underwater hull protection.

  5. Electrical insulation systems for transformers, busbars, and encapsulated components.

Specifications Of Huntsman Epoxy Polyamide Curing Agent Solution Aradur 30XWM55

Chemical TypePolyamide adduct modified for epoxy resin curing
Product FormClear to pale amber liquid
AppearanceHomogeneous, low-viscosity liquid
Primary ApplicationsAmbient-cure protective coatings, flooring, and structural adhesives
Key FeaturesLow volatility, extended pot life, flexible film formation
BenefitsImproved substrate wetting, reduced surface defects, excellent toughness
Recommended Epoxy ResinBisphenol-A or Bisphenol-F based liquid epoxy resins
Storage ConditionsStore in original sealed container at 15–25°C; protect from moisture


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