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Low-viscosity liquid formulation enabling easy handling and uniform mixing with epoxy resins.
Flexible cure profile with good reactivity at ambient temperatures and enhanced performance upon mild heat post-cure.
Excellent chemical resistance, particularly to alkalis, solvents, and industrial cleaning agents.
Provides superior adhesion to steel, concrete, and other substrates in demanding industrial environments.
Low odor and reduced amine blush tendency compared to conventional polyamide curing agents.
Industrial flooring systems for warehouses, manufacturing facilities, and pharmaceutical cleanrooms.
Protective coatings for steel infrastructure including bridges, pipelines, and offshore platforms.
Concrete repair mortars and high-performance grouts requiring rapid strength development.
Marine coatings for ballast tanks, cargo holds, and underwater hull protection.
Electrical insulation systems for transformers, busbars, and encapsulated components.
| Chemical Type | Polyamide adduct modified for epoxy resin curing |
| Product Form | Clear to pale amber liquid |
| Appearance | Homogeneous, low-viscosity liquid |
| Primary Applications | Ambient-cure protective coatings, flooring, and structural adhesives |
| Key Features | Low volatility, extended pot life, flexible film formation |
| Benefits | Improved substrate wetting, reduced surface defects, excellent toughness |
| Recommended Epoxy Resin | Bisphenol-A or Bisphenol-F based liquid epoxy resins |
| Storage Conditions | Store in original sealed container at 15–25°C; protect from moisture |
Q1: What is the primary function of Aradur 30XWM55 in epoxy systems?
A: Aradur 30XWM55 is a liquid polyamide-based curing agent solution designed to react with epoxy resins, enabling ambient- or low-temperature cure to form durable, chemically resistant thermoset networks. It is formulated to provide balanced pot life, flexibility, and adhesion across diverse substrates.
Q2: Is Aradur 30XWM55 suitable for food-contact or potable water applications?
A: Aradur 30XWM55 is not pre-qualified for direct food-contact or potable water applications. Its suitability for such uses depends on full system formulation, final cured performance, and compliance verification against applicable regional regulatory frameworks — end users must conduct appropriate testing and validation.
Q3: How does the solvent content in Aradur 30XWM55 affect processing and film formation?
A: The solution contains reactive diluents and solvents that improve viscosity control, substrate wetting, and mixing homogeneity. Volatile components evaporate during initial cure stages; optimal film formation requires adequate ventilation and consideration of ambient temperature and humidity to avoid surface defects or residual solvent entrapment.
Q4: Can Aradur 30XWM55 be used with standard bisphenol-A epoxy resins?
A: Yes — it is compatible with common liquid and solid bisphenol-A and bisphenol-F epoxy resins. Performance characteristics such as gel time, hardness development, and chemical resistance will vary depending on resin type, molecular weight, and overall formulation balance.
Q5: What storage conditions are recommended to maintain product stability?
A: Store in original sealed containers at temperatures between 10 °C and 30 °C, protected from moisture, direct sunlight, and freezing. Prolonged exposure to elevated temperatures or humidity may affect viscosity and reactivity over time.
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E-mail: wangxingqiang@ericwchem.com
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