Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Huntsman Polyetheramine Curing Agent D230

Huntsman Polyetheramine Curing Agent D230 is a low-viscosity, aliphatic amine hardener from the Jeffamine® D-series, widely used in epoxy resin systems for coatings, adhesives, and composites due to its excellent flexibility, fast cure speed, and low toxicity.
  • huntsman polyetheramine curing agent d230_db7dff0f
  • huntsman polyetheramine curing agent d230_db7dff0f

Features Of Huntsman Polyetheramine Curing Agent D230

  1. Low-viscosity liquid amine offering excellent flow and wetting characteristics for enhanced composite processing.

  2. Balanced reactivity profile enabling extended pot life with rapid room-temperature cure development.

  3. High flexibility and toughness in cured epoxy systems, delivering superior impact resistance and thermal shock performance.

  4. Low volatility and low odor, supporting safer handling and improved workplace air quality versus conventional aliphatic amines.

  5. Excellent adhesion to diverse substrates including metals, composites, and concrete without aggressive surface preparation.

Typical Applications Of Huntsman Polyetheramine Curing Agent D230

  1. Structural adhesives for aerospace and automotive bonding applications.

  2. High-performance coatings for industrial maintenance and marine environments.

  3. Electrical encapsulants and potting compounds requiring low stress and dimensional stability.

  4. Wind turbine blade bonding and repair systems demanding fatigue resistance and moisture tolerance.

  5. Concrete repair mortars and polymer-modified grouts for infrastructure rehabilitation.

Specifications Of Huntsman Polyetheramine Curing Agent D230

Chemical TypePolyetheramine (diamine, branched)
Product FormLiquid
AppearanceClear, light yellow to amber liquid
Amine Value490–510 mg KOH/g
Color (APHA)≤100
Viscosity @ 25°C300–500 cP
Primary ApplicationsEpoxy resin curing agent for adhesives, coatings, composites, and grouts
Key FeaturesLow viscosity, flexible cure, low volatility, excellent adhesion


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