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Exceptional water resistance after post-exposure baking, enabling high-yield processing in humid environments.
High photosensitivity to UV light (350–400 nm), allowing rapid exposure with standard diazo exposure units.
Excellent film-forming capability and adhesion to metal, polyester, and glass substrates without primers.
Stable emulsion formulation with shelf life of ≥12 months at 5–25°C when unopened.
Low haze and high optical clarity for precise pattern definition in fine-line photomasking applications.
Production of printed circuit board (PCB) solder masks and legend inks.
Manufacturing of flexible circuits on polyimide and PET substrates.
Photolithographic patterning for membrane switches and industrial control overlays.
Screen-printed conductive patterns in automotive and appliance control panels.
Industrial nameplate and durable label production requiring outdoor weatherability.
| Chemical Type | Diazo-naphthoquinone (DNQ) based photoactive compound in aqueous acrylic polymer emulsion |
| Product Form | Ready-to-use viscous milky-white emulsion (non-solvent-based) |
| Appearance | Uniform, slightly opalescent liquid; no phase separation or sedimentation |
| pH Range | 7.8 – 8.4 (at 25°C) |
| Solids Content | 32 ± 2 wt% (ASTM D2196) |
| Viscosity (Brookfield, LVT, Spindle #3, 25°C) | 8,500 – 11,000 cP |
| Primary Applications | Screen-printed photopolymerizable resist for industrial graphic and electronic masking |
| Regulatory Compliance | REACH compliant; RoHS 2015/863 Annex II: compliant for all restricted substances |
| Common Compatible Systems | Suitability |
| Standard flatbed and rotary screen printing presses (e.g., M&R, Svecia, Kammann) | Highly Recommended – Optimized rheology ensures clean stencil release and edge definition |
| UV exposure units with medium-pressure mercury vapor lamps (350–400 nm output) | Highly Recommended – Matched spectral sensitivity enables <60 s exposure at 20 mJ/cm² |
| Conveyorized forced-air thermal ovens (120–130°C) | Recommended – Full crosslinking achieved in 25–35 min; no blistering or cracking |
| Aqueous alkaline developers (0.5–1.0% Na₂CO₃, pH 10.8–11.2) | Suitable – Consistent development rate; minimal undercutting on 50–100 µm films |
Q1: What is the CAS Registry Number for KEY-PLUS 200B?
A: The CAS number for the proprietary diazo-photoreactive component is 65447-77-0; full product formulation is a trade secret and assigned internal batch-controlled identifier per ISO 9001 manufacturing protocol.
Q2: What is the recommended dry film thickness and corresponding wet application volume?
A: Target dry film thickness is 18–25 µm; apply 12–18 µm wet film using 150–200 mesh polyester screens (emulsion-side down), yielding ~11–14 g/m² wet pickup.
Q3: How does KEY-PLUS 200B differ from non-water-resistant diazo resists like KEY-PLUS 100?
A: KEY-PLUS 200B incorporates hydrophobic acrylic copolymer architecture and optimized DNQ dispersion, delivering >95% retention of resolution after 24-hr immersion in deionized water — versus <40% for KEY-PLUS 100 under identical conditions.
Q4: Is KEY-PLUS 200B compliant with food-contact regulations (e.g., FDA 21 CFR §175.300)?
A: No — KEY-PLUS 200B is not certified for direct or indirect food contact. It is formulated for industrial graphic and electronic applications only and contains components not listed under FDA §175.300 or EU Plastics Regulation (EU) No 10/2011.
Q5: Has migration or extractables testing been performed per IEC 62321 or ISO 10993 standards?
A: Yes — per IEC 62321-3-1:2013, no detectable levels (<1 ppm) of heavy metals (Pb, Cd, Hg, Cr⁶⁺) or phthalates were found in extracts from fully cured films. Full test reports available under NDA.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
