Fast-reacting aliphatic amine-based curing agent enabling rapid gelation and short demolding times.
Excellent compatibility with standard liquid epoxy resins (e.g., DGEBA types) without phase separation.
Low viscosity (< 500 cP at 25°C) ensures easy metering, mixing, and air-release during processing.
Good flexibility and impact resistance in cured epoxy systems, reducing brittleness in structural applications.
Low volatility and reduced amine odor compared to conventional aliphatic amines, improving workplace safety.
Structural adhesives for automotive assembly and metal bonding.
Electrical encapsulants and potting compounds for PCBs and power modules.
High-performance coating systems for industrial flooring and corrosion protection.
Rapid prototyping and low-pressure resin transfer molding (RTM) composites.
Repair mortars and grouts requiring fast strength development under ambient conditions.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Viscosity (25°C) | 350–450 cP |
| Amine Value | 380–420 mg KOH/g |
| Density (25°C) | 0.92–0.95 g/cm³ |
| Flash Point (COC) | ≥ 110°C |
| Shelf Life (unopened, 25°C) | 12 months |
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E-mail: wangxingqiang@ericwchem.com
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