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Low-viscosity liquid formulation for excellent mixing and processing with epoxy resins.
Fast room-temperature cure profile enabling high-throughput manufacturing.
Superior chemical resistance to solvents, acids, and alkalis after full cure.
Low exotherm during curing—ideal for thick-section casting and sensitive substrates.
Excellent adhesion to metals, composites, and concrete without primer requirement.
Structural adhesives for automotive and aerospace assembly.
High-performance potting and encapsulation compounds for electronics.
Repair mortars and industrial flooring systems.
Composite matrix resin for wind turbine blades and marine components.
Electrical insulation varnishes and coil impregnation formulations.
| Chemical Type | Amine-based aliphatic polyamine adduct |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid |
| Density (25°C) | 0.94–0.97 g/cm³ |
| Amine Value | 210–230 mg KOH/g |
| Reactive Hydrogen Equivalent Weight | 85–95 g/eq |
| Storage Stability | 12 months at 25°C in sealed original container |
| Primary Applications | Room-temperature and elevated-temperature cured epoxy systems |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
