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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring primers.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing via casting, impregnation, and resin transfer molding (RTM).
Good thermal stability with glass transition temperature (Tg) up to 130°C after post-cure.
Low chloride content (< 500 ppm), ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural bonding in wind turbine blade assembly and aerospace composite components.
Prepreg systems for carbon fiber reinforced polymer (CFRP) laminates in automotive lightweighting.
High-performance potting compounds for industrial sensors and power electronics modules.
Marine-grade protective coatings and corrosion-resistant linings for chemical storage tanks.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | < 500 ppm |
| Softening Point | 12–18°C |
| Storage Stability | 12 months at < 25°C in unopened original containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
