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High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent mechanical strength and chemical resistance after full crosslinking.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing, impregnation, and bubble-free casting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good adhesion to metals, composites, and cured polymer substrates without primer.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Potting and sealing of power electronics modules and PCB assemblies.
Structural bonding in wind turbine blade components and automotive composite parts.
Manufacturing of filament-wound pressure vessels and FRP tanks.
High-performance tooling resins for molds used in aerospace and marine composite layup.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | < 1,000 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 25°C in sealed original packaging |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
