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High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent mechanical strength and chemical resistance after full crosslinking.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing, impregnation, and bubble-free casting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good adhesion to metals, composites, and cured polymer substrates without primer.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Potting and sealing of power electronics modules and PCB assemblies.
Structural bonding in wind turbine blade components and automotive composite parts.
Manufacturing of filament-wound pressure vessels and FRP tanks.
High-performance tooling resins for molds used in aerospace and marine composite layup.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | < 1,000 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 25°C in sealed original packaging |
Q1: What is the primary functional role of KD-243C in epoxy formulations?
A: KD-243C is a reactive liquid diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising crosslink density or thermal performance.
Q2: Is KD-243C compatible with common amine and anhydride curing agents?
A: Yes, KD-243C exhibits broad compatibility with aliphatic and cycloaliphatic amines, as well as aromatic amines and acid anhydrides typically used in high-performance epoxy systems.
Q3: How does KD-243C affect the final cured film properties compared to non-diluted epoxy systems?
A: When properly formulated, KD-243C helps maintain good mechanical strength, adhesion, and chemical resistance while enabling improved wetting of substrates and reduced air entrapment—particularly beneficial in casting, potting, and coating applications.
Q4: Can KD-243C be used in heat-cured versus ambient-cured systems?
A: Yes—it performs effectively in both ambient-cure systems with reactive accelerators and elevated-temperature cure cycles, supporting flexibility across diverse manufacturing conditions.
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E-mail: wangxingqiang@ericwchem.com
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