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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior thermal stability with glass transition temperature (Tg) up to 180°C after full cure.
Low chloride content (<0.02 wt%) ensuring compatibility with sensitive electronic encapsulation applications.
Structural adhesive formulations for aerospace composite bonding.
Electrical encapsulation and potting of high-voltage power modules and IGBTs.
Wind turbine blade root joint and spar cap infusion resins.
High-performance filament winding resins for pressure vessels and piping.
Tooling and mold-making compounds requiring dimensional stability and low exotherm.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear, amber-colored liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 186–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤0.02 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤25°C in sealed containers |
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