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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior thermal stability with glass transition temperature (Tg) up to 180°C after full cure.
Low chloride content (<0.02 wt%) ensuring compatibility with sensitive electronic encapsulation applications.
Structural adhesive formulations for aerospace composite bonding.
Electrical encapsulation and potting of high-voltage power modules and IGBTs.
Wind turbine blade root joint and spar cap infusion resins.
High-performance filament winding resins for pressure vessels and piping.
Tooling and mold-making compounds requiring dimensional stability and low exotherm.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear, amber-colored liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 186–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤0.02 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤25°C in sealed containers |
Q1: What is the primary functional role of KD-410J in epoxy formulations?
A: KD-410J is a reactive liquid diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising crosslink density or thermal performance.
Q2: Is KD-410J compatible with common amine and anhydride curing agents?
A: Yes — KD-410J demonstrates broad compatibility with aliphatic and cycloaliphatic amines, aromatic amines, and anhydride hardeners. It participates in the cure reaction as a co-monomer, contributing to network formation rather than acting as an inert diluent.
Q3: How does KD-410J affect the final cured film properties compared to non-reactive diluents?
A: Unlike non-reactive diluents, KD-410J becomes chemically integrated into the polymer network, helping retain mechanical strength, chemical resistance, and glass transition temperature (Tg) at moderate incorporation levels.
Q4: What is the typical dosage range for KD-410J in industrial epoxy systems?
A: Dosage is formulation-dependent, but it is generally used at low concentrations — typically ranging from 0.1% to 2% by weight relative to the base epoxy resin — to achieve targeted viscosity reduction while maintaining reactivity and final properties.
Q5: Can KD-410J be used in applications requiring low volatile organic compound (VOC) content?
A: Yes — KD-410J is a low-volatility, reactive component with negligible vapor pressure under standard processing conditions, making it suitable for formulating low-VOC and high-solids epoxy coatings, adhesives, and composites.
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