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High-performance bisphenol-A based liquid epoxy resin with excellent mechanical strength and chemical resistance.
Low viscosity for easy handling, mixing, and impregnation in composite and casting applications.
Optimized reactivity profile enabling reliable cure with standard amine or anhydride hardeners.
Superior electrical insulation properties suitable for high-voltage and electronic encapsulation uses.
Consistent batch-to-batch quality meeting ISO 9001 certified manufacturing standards.
Electrical insulation and potting of transformers, reactors, and busbar systems.
Structural composites in wind turbine blades and aerospace interior components.
High-voltage insulators and GIS (Gas-Insulated Switchgear) encapsulation.
Industrial flooring and heavy-duty protective coatings for chemical plants.
Adhesives and bonding agents for metal-to-metal and metal-to-composite assemblies.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, transparent liquid without sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in unopened original packaging |
Q1: What is the primary functional role of KD-448J in epoxy formulations?
A: KD-448J is a reactive liquid diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising crosslink density or thermal performance.
Q2: Is KD-448J suitable for high-gloss, low-VOC coating systems?
A: Yes — as a reactive diluent, KD-448J becomes part of the polymer network during cure, contributing minimal volatile content and supporting formulation of high-solids, low-VOC coatings with good flow, leveling, and surface appearance.
Q3: How does KD-448J compare to non-reactive diluents in terms of mechanical property retention?
A: Unlike non-reactive (inert) diluents, KD-448J participates in the curing reaction, enabling better retention of tensile strength, glass transition temperature (Tg), and chemical resistance in the final cured film or composite.
Q4: Can KD-448J be used in electrical encapsulation or potting applications?
A: Yes — its low volatility, good compatibility with common epoxy hardeners, and ability to yield low-stress, well-adhered cured networks make it suitable for select electrical insulation and encapsulation formulations where reduced exotherm and improved wetting are beneficial.
Q5: What storage conditions are recommended to maintain KD-448J stability?
A: Store in original sealed containers at temperatures between 10 °C and 30 °C, away from direct sunlight and moisture. Prolonged exposure to elevated temperatures or humidity may affect reactivity and viscosity over time.
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
