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High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (1,800–2,200 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior thermal stability with glass transition temperature (Tg) exceeding 125°C after full cure with DDS.
Low chlorine content (<0.05% w/w), supporting high electrical insulation performance and corrosion resistance.
Electrical encapsulation of high-voltage insulators and power electronics modules.
Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for carbon fiber and fiberglass prepregs used in wind turbine blades and sporting goods.
Castable systems for precision tooling, industrial jigs, and dielectric bushings.
Coating and lining applications in chemical process equipment requiring solvent resistance and dimensional stability.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 1,800–2,200 cP |
| Chlorine Content | ≤0.05 wt% |
| Volatiles Content | ≤0.3 wt% |
| Storage Stability | ≥12 months at 20–25°C in sealed containers |
Q1: What is the primary functional role of KUKDO SM-687 in epoxy formulations?
A: KUKDO SM-687 is a reactive liquid epoxy resin modifier designed to enhance flexibility, impact resistance, and adhesion performance without significantly compromising thermal stability or chemical resistance. It functions as a co-resin or toughening agent in bisphenol-A or bisphenol-F based systems.
Q2: Is SM-687 compatible with standard amine and anhydride curing agents?
A: Yes, SM-687 exhibits good compatibility with common aliphatic and aromatic amines, as well as cyclic anhydrides. It participates in the crosslinking reaction via its epoxide groups, contributing to network formation rather than acting solely as an inert diluent.
Q3: How does SM-687 affect pot life and gel time in formulated systems?
A: As a low-viscosity reactive modifier, SM-687 typically extends working time slightly compared to unmodified high-functionality resins—especially at ambient temperatures—but does not drastically retard cure kinetics when used within recommended dosage ranges. Actual effect depends on the base resin and curing agent selection.
Q4: Can SM-687 be used in coatings requiring FDA-compliant food-contact performance?
A: SM-687 is not pre-certified for direct food-contact applications. Its suitability for such use depends entirely on the final cured formulation, processing conditions, and regulatory evaluation by the end-user or their qualified regulatory consultant. It is intended for industrial and protective coating applications unless specifically validated otherwise.
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