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High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (1,800–2,200 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior thermal stability with glass transition temperature (Tg) exceeding 125°C after full cure with DDS.
Low chlorine content (<0.05% w/w), supporting high electrical insulation performance and corrosion resistance.
Electrical encapsulation of high-voltage insulators and power electronics modules.
Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for carbon fiber and fiberglass prepregs used in wind turbine blades and sporting goods.
Castable systems for precision tooling, industrial jigs, and dielectric bushings.
Coating and lining applications in chemical process equipment requiring solvent resistance and dimensional stability.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 1,800–2,200 cP |
| Chlorine Content | ≤0.05 wt% |
| Volatiles Content | ≤0.3 wt% |
| Storage Stability | ≥12 months at 20–25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
