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High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) up to 125°C after full cure.
Electrical encapsulation of power modules, IGBTs, and high-voltage sensors.
Structural adhesive formulations for aerospace composite bonding and repair.
Underfill and glob-top protection for fine-pitch semiconductor packaging.
High-performance potting compounds for outdoor LED drivers and renewable energy inverters.
Matrix resin for carbon fiber reinforced laminates requiring low exotherm and dimensional stability.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
