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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy handling, degassing, and deep impregnation.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to alkalis, diluted acids, and common solvents after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural bonding in wind turbine blade assembly and aerospace composite components.
Matrix resin for filament-wound pressure vessels and carbon fiber reinforced tanks.
Castings and potting compounds for power electronics and EV battery module protection.
Repair and refurbishment of industrial flooring and concrete infrastructure.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | < 1,000 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 25°C in sealed original container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
