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High purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity (10,000–12,000 cP at 25°C) for easy processing and improved filler wetting.
Superior electrical insulation properties and thermal stability up to 130°C continuous use.
Consistent batch-to-batch performance meeting ISO 9001 certified manufacturing standards.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesives for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for filament-wound pressure vessels and fiber-reinforced polymer (FRP) tanks.
Underfill and glob-top materials in semiconductor packaging and electronic module protection.
High-performance coatings for corrosion-resistant linings in chemical process equipment.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow viscous liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 700 ppm |
| Softening Point | 12–15°C |
| Color (Gardner) | ≤ 2 |
| Volatiles (150°C, 2 hrs) | ≤ 0.3 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
