High-purity bisphenol-A type liquid epoxy resin with low chlorine content.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity (10,000–14,000 mPa·s at 25°C) enabling easy processing and impregnation.
Superior electrical insulation properties and thermal stability up to 130°C continuous use.
Consistent batch-to-batch quality meeting stringent JIS K 7203 and ASTM D1654 specifications.
Electrical encapsulation and potting compounds for transformers and reactors.
High-voltage insulators and bushings requiring long-term dielectric reliability.
Prepregs and laminates in printed circuit board (PCB) base materials.
Composite matrix resin for aerospace and wind turbine blade components.
Structural adhesives demanding high shear strength and moisture resistance.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 10,000–14,000 mPa·s |
| Chloride Content | ≤ 700 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at 25°C in sealed original packaging |
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E-mail: wangxingqiang@ericwchem.com
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