Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SMP-105 Epoxy Resin

KUKDO SMP-105 Epoxy Resin is a high-performance bisphenol-A based liquid epoxy resin designed for electrical encapsulation and laminating applications. It offers excellent adhesion, low viscosity, superior dielectric properties, and thermal stability. Widely used in PCB laminates, LED encapsulants, and insulating coatings. Compatible with standard amine and anhydride hardeners. Meets RoHS and REACH compliance. Ideal for demanding industrial and electronics manufacturing environments.
  • kukdo smp 105 epoxy resin_39ce6c10
  • kukdo smp 105 epoxy resin_39ce6c10

Features Of KUKDO SMP-105 Epoxy Resin

  1. High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.

  2. Excellent chemical resistance to alkalis, dilute acids, and polar solvents.

  3. Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing and efficient filler dispersion.

  4. Superior adhesion to metals, glass, and composite substrates without surface priming.

  5. Optimized for room-temperature and elevated-temperature curing systems with standard amine or anhydride hardeners.

Typical Applications Of KUKDO SMP-105 Epoxy Resin

  1. Structural adhesives for automotive and aerospace bonding.

  2. Electrical encapsulation and potting compounds for PCBs and power modules.

  3. High-performance composites in wind turbine blades and sporting goods.

  4. Coatings for corrosion-resistant industrial flooring and tank linings.

  5. Matrix resin for filament-wound pressure vessels and piping systems.

Specifications Of KUKDO SMP-105 Epoxy Resin

Chemical TypeBisphenol-A diglycidyl ether (DGEBA)
Product FormClear, low-viscosity liquid
AppearancePale yellow to water-white, transparent
Epoxy Equivalent Weight (EEW)185–192 g/eq
Viscosity (25°C)10,000–12,000 cP
Chlorine Content≤ 800 ppm
Softening Point12–15°C
Storage Stability≥ 12 months at 20–25°C in sealed container


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