High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent chemical resistance to alkalis, dilute acids, and polar solvents.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing and efficient filler dispersion.
Superior adhesion to metals, glass, and composite substrates without surface priming.
Optimized for room-temperature and elevated-temperature curing systems with standard amine or anhydride hardeners.
Structural adhesives for automotive and aerospace bonding.
Electrical encapsulation and potting compounds for PCBs and power modules.
High-performance composites in wind turbine blades and sporting goods.
Coatings for corrosion-resistant industrial flooring and tank linings.
Matrix resin for filament-wound pressure vessels and piping systems.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | 12–15°C |
| Storage Stability | ≥ 12 months at 20–25°C in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China