Low-viscosity liquid epoxy resin enabling excellent flow and wetting for complex substrates.
High purity with minimal ionic impurities, ensuring superior electrical insulation performance.
Excellent compatibility with standard amine and anhydride curing agents for flexible formulation design.
Good thermal stability and hydrolytic resistance for reliable long-term service in demanding environments.
Consistent batch-to-batch quality meeting stringent ISO 9001 manufacturing controls.
Electrical potting and encapsulation of transformers, reactors, and high-voltage sensors.
Insulating varnishes and coil impregnation for motors, generators, and inductors.
High-performance laminating resins for printed circuit board (PCB) prepregs and base materials.
Structural adhesives requiring low shrinkage and high dielectric strength.
| Chemical Type | Bisphenol-A based diglycidyl ether epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–15°C |
| Storage Stability | ≥ 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China