High reactivity with standard amine and anhydride hardeners for rapid cure development.
Excellent adhesion to metals, composites, and cured epoxy substrates.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing and good wetting in composite impregnation.
Good thermal stability with glass transition temperature (Tg) up to 130°C after post-cure.
Consistent batch-to-batch quality meeting ISO 9001 manufacturing controls.
Aerospace structural adhesives and composite bonding films.
Electrical encapsulation and potting compounds for high-voltage insulation.
Wind turbine blade matrix resin in vacuum-assisted resin transfer molding (VARTM).
High-performance tooling and mold-making resins for carbon fiber layup.
Marine-grade coating binders requiring chemical resistance and hydrolytic stability.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gels or particulates |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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