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High reactivity with standard amine and anhydride hardeners for rapid cure development.
Excellent adhesion to metals, composites, and cured epoxy substrates.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing and good wetting in composite impregnation.
Good thermal stability with glass transition temperature (Tg) up to 130°C after post-cure.
Consistent batch-to-batch quality meeting ISO 9001 manufacturing controls.
Aerospace structural adhesives and composite bonding films.
Electrical encapsulation and potting compounds for high-voltage insulation.
Wind turbine blade matrix resin in vacuum-assisted resin transfer molding (VARTM).
High-performance tooling and mold-making resins for carbon fiber layup.
Marine-grade coating binders requiring chemical resistance and hydrolytic stability.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gels or particulates |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
Q1: What is the primary function of KUKDO YD-014DLM in epoxy formulations?
A: KUKDO YD-014DLM is a reactive diluent designed to reduce viscosity and improve processability of standard bisphenol-A based epoxy resins without significantly compromising final crosslink density or thermal performance.
Q2: Is YD-014DLM suitable for high-gloss coating systems?
A: Yes — its low volatility and compatibility with common curing agents help support excellent surface appearance, clarity, and gloss retention in decorative and protective coatings, especially where reduced VOC content is desired.
Q3: How does YD-014DLM compare to non-reactive diluents in terms of film properties?
A: Unlike non-reactive diluents, YD-014DLM participates in the curing reaction, contributing to the polymer network — this helps maintain better chemical resistance, hardness, and adhesion in the cured film.
Q4: Can YD-014DLM be used in UV-curable epoxy systems?
A: No — YD-014DLM is formulated for thermally cured or ambient-cured amine-based epoxy systems and is not compatible with cationic UV photoinitiators or typical UV-curing mechanisms.
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