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High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with common amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and high dielectric strength for electronic encapsulation.
Good thermal stability and mechanical toughness in cured state, supporting long-term reliability.
Electrical & electronic encapsulants for transformers, reactors, and power modules.
High-voltage insulating castings and potting compounds in energy infrastructure.
Structural adhesives requiring high bond strength and environmental resistance.
Composite matrix resin for fiber-reinforced laminates in industrial tooling.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear amber liquid |
| Appearance | Transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 188–194 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, casting, adhesive, composite matrix |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
