High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with common amine and anhydride curing agents.
Good thermal stability and mechanical strength after full cure.
Low viscosity for enhanced processability in casting, impregnation, and coating applications.
Consistent batch-to-batch quality meeting ISO 9001 manufacturing standards.
Electrical insulation systems for transformers and reactors.
Structural adhesives requiring high bond strength and temperature resistance.
Encapsulation compounds for electronic components and sensors.
High-performance composite matrices in wind turbine blade and aerospace tooling.
Powder coating binders for durable industrial metal finishes.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, transparent liquid without suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–15,000 cP |
| Chlorine Content | ≤ 900 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, structural composites, encapsulation, adhesive formulations |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China