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High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent thermal stability and consistent reactivity for reliable curing performance.
Low viscosity enables easy handling, mixing, and impregnation in composite processes.
Superior electrical insulation properties suitable for high-performance electronic encapsulation.
Good adhesion to metals, glass fibers, and common engineering substrates.
Electrical and electronic encapsulants for transformers, sensors, and PCB potting.
Structural adhesives in automotive and aerospace assembly.
Matrix resin for filament-wound composite pressure vessels and pipes.
Coating formulations for corrosion-resistant industrial linings and tank interiors.
High-voltage insulating castings and bushing components.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Transparent, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 10,000–14,000 cP |
| Chlorine Content | ≤ 700 ppm |
| Softening Point | 10–15°C |
| Storage Stability | ≥ 12 months at 25°C in sealed container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
