Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KY Chemical Universal Curing Agent BG-75

KYChemicalUniversalCuringAgentBG-75isahigh-performancepolyamide-basedcuringagentfromtheUniversalseries,designedforrapidcureandexcellentchemicalresistanceinepoxyresins.Idealforcoatings,adhesives,andcomposites,itofferssuperiorflexibility,lowtemperaturecuringcapability,andenhancedmechanicalstrengthwithoutvolatileorganiccompounds.
  • ky chemical universal curing agent bg 75_7c090f85
  • ky chemical universal curing agent bg 75_7c090f85

Features Of KY Chemical Universal Curing Agent BG-75

  1. Broad-spectrum compatibility with epoxy resins, including standard DGEBA, novolac, and cycloaliphatic types.

  2. Room-temperature curing capability with adjustable gel time (20–60 min at 25°C), enabling flexible processing windows.

  3. Low viscosity (<1,200 cP at 25°C) for easy handling, precise metering, and excellent wetting of fillers and reinforcements.

  4. Excellent thermal stability with glass transition temperature (Tg) exceeding 120°C in fully cured systems.

  5. Low odor and low volatility formulation, supporting safer industrial handling and compliance with VOC-restricted environments.

Typical Applications Of KY Chemical Universal Curing Agent BG-75

  1. Electrical insulation encapsulants and potting compounds for transformers, sensors, and power electronics.

  2. High-performance structural adhesives in automotive and aerospace composite bonding.

  3. Wind turbine blade bonding and repair matrices requiring fatigue resistance and moisture tolerance.

  4. Protective coatings for metal and concrete substrates in marine and chemical processing environments.

  5. Tooling and casting resins for rapid prototyping and mold-making applications.

Specifications Of KY Chemical Universal Curing Agent BG-75

Chemical TypeAmine-based polyfunctional curing agent
Product FormLiquid
AppearancePale yellow to amber clear liquid
Density (25°C)1.02–1.05 g/cm³
Viscosity (25°C)1,000–1,300 cP
Amine Value380–420 mg KOH/g
Primary ApplicationsEpoxy resin curing for adhesives, coatings, composites, and encapsulants
Storage Stability12 months in original sealed container at 5–30°C


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