Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Mitsui EPOKEY 868 Epoxy Resin

Mitsui EPOKEY 868 is a high-purity bisphenol-A epoxy resin from Mitsui Chemicals’ EPOKEY series, offering excellent adhesion, chemical resistance and thermal stability for coatings, composites and electronic encapsulation applications.
  • mitsui epokey 868 epoxy resin_4fac9c40
  • mitsui epokey 868 epoxy resin_4fac9c40

Features Of Mitsui EPOKEY 868 Epoxy Resin

  1. High-purity bisphenol-A based liquid epoxy resin with low chlorine content.

  2. Excellent compatibility with standard amine and anhydride curing agents.

  3. Superior electrical insulation properties and thermal stability up to 130 °C.

  4. Low viscosity (12,000–14,000 mPa·s at 25 °C) enabling easy processing and impregnation.

  5. Consistent batch-to-batch quality meeting strict JIS K 6911 and ISO 9001 requirements.

Typical Applications Of Mitsui EPOKEY 868 Epoxy Resin

  1. Electrical insulation systems for medium-voltage motors and generators.

  2. Encapsulation and potting of power electronics and IGBT modules.

  3. Winding impregnation resins for industrial transformers and reactors.

  4. Structural adhesives in high-reliability aerospace and rail traction components.

  5. Base resin for flame-retardant composite laminates (when formulated with ATH or phosphorus additives).

Specifications Of Mitsui EPOKEY 868 Epoxy Resin

Chemical TypeBisphenol-A diglycidyl ether (DGEBA)
Product FormClear, pale yellow liquid
AppearanceTransparent, slightly viscous liquid, free from gel particles or haze
Epoxy Equivalent Weight (EEW)187–193 g/eq
Viscosity (25 °C)12,000–14,000 mPa·s
Chloride Content≤ 500 ppm
Softening Point12–16 °C
Primary ApplicationsElectrical insulation, encapsulation, impregnation, structural composites


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