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High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and treated plastics without requiring aggressive surface pretreatment.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing via casting, impregnation, and resin transfer molding (RTM).
Superior chemical resistance to alkalis, dilute acids, and common solvents after full cure.
Low chloride content (< 500 ppm), supporting high reliability in electronic encapsulation and aerospace bonding applications.
Structural adhesive formulations for automotive chassis and EV battery module bonding.
Encapsulation and potting of power electronics, including IGBT modules and DC-DC converters.
Matrix resin for carbon fiber reinforced polymer (CFRP) components in wind turbine blades and UAV airframes.
High-performance flooring and industrial coating systems requiring abrasion and chemical resistance.
Electrical insulation systems in medium-voltage transformers and dry-type reactors.
| Chemical Type | Bisphenol-F based diglycidyl ether epoxy resin |
| Product Form | Liquid, low-viscosity clear to pale yellow |
| Appearance | Transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 168–174 g/eq |
| Viscosity (25°C) | 9,500–11,500 cP |
| Chloride Content | ≤ 450 ppm |
| Softening Point | 12–16°C |
| Primary Applications | Adhesives, encapsulants, composites, electrical insulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
