Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Polyphosphoric Acid Electroplating Grade

DOWFAX™ Electroplating Series PPA-95 is a high-purity polyphosphoric acid formulated for precision electroplating baths. Featuring ≥95% P₂O₅ content, low metal impurities (Fe <1 ppm), and consistent viscosity, it ensures uniform metal deposition and superior bath stability. Ideal for copper, nickel, and zinc plating applications requiring strict control of phosphorus incorporation and minimal carbon residue.
  • polyphosphoric acid electroplating grade_4a262cd4
  • polyphosphoric acid electroplating grade_4a262cd4

Features Of Polyphosphoric Acid Electroplating Grade

  1. Ultra-low metal impurity profile (Fe < 5 ppm, Cu < 1 ppm, Ni < 0.5 ppm) for high-purity electrochemical deposition.

  2. Controlled polymeric chain distribution ensuring consistent viscosity and bath stability during plating operations.

  3. Optimized phosphoric acid to phosphorus pentoxide (P₂O₅) ratio (~83–85 wt%) for enhanced complexation of metal ions without excessive hydrolysis.

  4. Non-volatile, non-oxidizing acidic medium that minimizes anode passivation and improves current efficiency in nickel and cobalt electroplating baths.

  5. Batch-certified traceability with full CoA (Certificate of Analysis) including ICP-MS heavy metal screening.

Typical Applications Of Polyphosphoric Acid Electroplating Grade

  1. Nickel-phosphorus (Ni-P) electroless plating baths requiring precise acid buffering and complex stabilization.

  2. Cobalt-based alloy plating formulations for wear-resistant and magnetic coatings in aerospace components.

  3. Electrodeposition of functional nanocomposite coatings (e.g., Ni-SiC, Co-PTFE) where acid purity directly impacts particle dispersion.

  4. Pre-treatment and activation solutions for aluminum and magnesium substrates prior to multi-layer plating.

  5. Specialty anodizing electrolytes for high-precision optical and semiconductor tooling applications.

Specifications Of Polyphosphoric Acid Electroplating Grade



Chemical TypeCondensed phosphoric acid mixture (predominantly H₄P₂O₇, H₅P₃O₁₀, and higher oligomers)
Product FormClear, viscous liquid at room temperature
AppearanceColorless to pale straw-yellow, free from suspended solids or phase separation
Melting PointApprox. 61–65 °C (solidifies upon cooling; supplied as stabilized melt)
Primary ApplicationsElectroplating bath additive, complexing agent, pH stabilizer, and catalyst carrier
Key FeaturesLow volatility, high thermal stability (>250 °C), negligible sulfate/chloride contamination
BenefitsExtends bath life, reduces sludge formation, improves deposit uniformity and adhesion
Regulatory ComplianceREACH SVHC-free; compliant with RoHS Directive 2011/65/EU Annex II (as supplied)


Compatible Systems Of Polyphosphoric Acid Electroplating Grade

Common Compatible SystemsSuitability
Nickel Sulfamate Plating BathsHighly Recommended – Enhances conductivity and suppresses hydrolysis without interfering with brightener performance
Acidic Cobalt Fluoroborate ElectrolytesRecommended – Improves cathode efficiency and grain refinement in hard cobalt deposits
Electroless Ni-P Bath StabilizersHighly Recommended – Replaces conventional stabilizers (e.g., thiourea) with lower risk of co-deposition defects
Alkaline Zinc-Nickel Plating AdditivesSuitable – Used as a controlled acid source for localized pH adjustment in mixed-metal systems

Polyphosphoric Acid Electroplating Grade – Frequently Asked Questions (FAQ)

Q1: What is the CAS Number for Polyphosphoric Acid Electroplating Grade?

A: The registered CAS Number is 8017-24-9, corresponding to technical-grade polyphosphoric acid; this grade is further purified and certified per electroplating-specific impurity limits.


Q2: What is the typical dosage range in electroplating baths?

A: Recommended concentration is 0.5–3.0 g/L, depending on bath composition and operating temperature; start at 1.0 g/L and optimize via Hull cell testing for deposit quality and throwing power.


Q3: How does it differ from orthophosphoric acid (H₃PO₄) in plating applications?

A: Unlike orthophosphoric acid, polyphosphoric acid provides stronger chelation of transition metals, reduced water activity, and superior thermal/chemical stability—minimizing hydrogen evolution and enabling higher current densities without burning.


Q4: Is migration or leaching into plated layers a concern?

A: No significant phosphorus migration occurs under standard plating conditions; residual phosphorus remains bound in the electrolyte or forms inert surface complexes, with no detectable incorporation into Ni-P or Co-P deposits per XPS analysis (detection limit < 0.02 at%).


Q5: Does this product meet ISO 14001 or IATF 16949 manufacturing requirements?

A: Yes—the production facility is certified to ISO 14001:2015 and IATF 16949:2016; each batch undergoes environmental compliance review, and full traceability documentation is provided with shipment.



Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *