RZJ-305 Photoresist

Features Of RZJ-305 Photoresist

1. High-resolution patterning capability with sub-micron resolution (≤ 0.8 µm) under standard i-line (365 nm) exposure.

2. Excellent thermal stability up to 130 °C post-bake, minimizing pattern deformation during downstream processing.

3. Fast and uniform development in standard 0.26 N TMAH aqueous solution with high contrast (γ > 5.0).

4. Low outgassing behavior during vacuum-based processes, reducing contamination risk in lithography clusters.

5. Consistent lot-to-lot performance validated by in-house QC using SEM metrology and CD uniformity analysis.

Typical Applications Of RZJ-305 Photoresist

1. Microelectromechanical systems (MEMS) fabrication requiring high aspect ratio etch compatibility.

2. Semiconductor packaging photolithography, including redistribution layer (RDL) and bump mask applications.

3. Flexible printed electronics manufacturing on PET and PI substrates.

4. Optical waveguide patterning for integrated photonics devices.

5. Maskless direct-write lithography in R&D and low-volume prototyping environments.

Specifications Of RZJ-305 Photoresist

Compatible Systems Of RZJ-305 Photoresist

RZJ-305 Photoresist – Frequently Asked Questions (FAQ)

Q1: What is the CAS Registry Number for RZJ-305 Photoresist?

A: RZJ-305 is a proprietary multi-component formulation; individual constituents have CAS numbers (e.g., PGMEA: 108-65-6, DNQ: 1337-24-2), but the final product is not assigned a single CAS number per IUPAC and regulatory guidance for complex mixtures.

Q2: What is the recommended coating thickness and corresponding spin speed for RZJ-305 on silicon wafers?

A: At 3000 rpm (30 sec), typical dry film thickness is 1.8–2.2 µm on bare Si; thickness scales predictably from 2000 rpm (≈3.0 µm) to 4000 rpm (≈1.2 µm). Thickness verification via ellipsometry or cross-sectional SEM is recommended for critical layers.

Q3: How does RZJ-305 compare to RZJ-200 series in terms of resolution and process window?

A: RZJ-305 offers higher resolution (≤0.8 µm vs. ≥1.2 µm for RZJ-200) and wider depth-of-focus (DOF > 1.1 µm at 0.9 µm line/space), achieved via optimized resin molecular weight distribution and enhanced DNQ photochemistry — ideal for advanced packaging where RZJ-200 remains suitable for coarse-feature applications.

Q4: Is RZJ-305 compliant with food-contact or medical device regulations (e.g., USP Class VI, ISO 10993)?

A: No — RZJ-305 is formulated exclusively for industrial semiconductor and microfabrication use. It is not intended, tested, or certified for food-contact surfaces, implantable devices, or biological applications. Residual monomer and solvent content are not evaluated per USP/ISO biocompatibility standards.

Q5: Has migration or extractables testing been performed for RZJ-305 under thermal stress (e.g., 120 °C for 2 hrs)?

A: Yes — GC-MS analysis of extracts from thermally cured RZJ-305 films (120 °C/2 h) confirmed <0.5 ppm total volatile organic extractables; major residuals were trace PGMEA and methyl phenol (<0.1 ppm each), well below ICH Q3C thresholds for pharmaceutical manufacturing equipment coatings.