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Thermally activated — releases strong Brønsted acid (DBU-H⁺) only upon heating above 100 °C, enabling precise temporal control of acid generation.
High thermal latency — remains stable below 90 °C for extended periods, ensuring excellent shelf life and processing safety.
Non-volatile and low-odor — minimizes workplace exposure concerns and avoids outgassing issues in sealed or high-vacuum processes.
Clean decomposition profile — yields no volatile by-products or corrosive halides, supporting high-purity electronic and optical applications.
Compatible with common photopolymer resins and epoxy matrices — enables seamless integration into existing formulation workflows without reformulation.
Photoresist post-exposure bake (PEB) catalysts for advanced semiconductor lithography (e.g., EUV and DUV).
Thermally triggered crosslinking agents in high-performance epoxy encapsulants and underfill materials.
Acid-catalyzed condensation curing in silicone-based release coatings and anti-stick layers.
Latent catalyst for polyimide precursor imidization in flexible printed circuit (FPC) manufacturing.
Controlled deblocking agent in thermally responsive protective coatings for aerospace composites.
| Chemical Type | DBU-derived quaternary ammonium salt (non-sulfonate, non-halogenated) |
| Product Form | White to off-white crystalline powder |
| Appearance | Free-flowing crystalline solid |
| Melting Point | 118–123 °C (DSC onset) |
| Onset Decomposition Temperature | ≥105 °C (TGA, 5 °C/min, N₂) |
| Primary Applications | Latent thermal acid generator for microelectronics, advanced packaging, and high-temp coatings |
| Key Features | Low volatility, halogen-free, no SO₂ or HCl evolution |
| Regulatory Compliance | REACH registered; RoHS 2015/863 compliant; no SVHCs listed as of latest update |
| Common Compatible Systems | Suitability |
| Epoxies (e.g., DGEBA, Novolac-type) | Highly Recommended – Enables rapid, low-temperature cationic polymerization with minimal side reactions |
| Phenolic resins (alkylated & unmodified) | Recommended – Effective in heat-triggered methylolation and crosslinking at 120–150 °C |
| Acrylic/methacrylic monomer blends (e.g., TMPTA, HDDA) | Suitable – Requires co-initiator (e.g., iodonium salt) for efficient radical-acid synergy |
| Polyimide precursors (PAA solutions) | Highly Recommended – Promotes efficient thermal imidization without bubble formation or discoloration |
Q1: What is the CAS Registry Number for San-Apro DBU Thermal Acid Generator?
A: The CAS number is 2207024-89-1. This identifier corresponds specifically to the proprietary DBU-derived quaternary ammonium carboxylate structure used in this grade.
Q2: What is the typical recommended loading level in epoxy formulations?
A: Standard dosage ranges from 0.5 to 3.0 wt% relative to resin solids, depending on cure temperature profile and desired gel time; optimization via DSC is recommended for critical applications.
Q3: How does San-Apro DBU T-AG differ from traditional sulfonium or iodonium salt generators?
A: Unlike photoactive sulfonium/iodonium salts, San-Apro DBU T-AG is thermally specific, halogen-free, and generates no aryl halide or sulfur-containing volatiles — reducing corrosion risk and improving compatibility with sensitive metallizations.
Q4: Is migration or extractable acid a concern in food-contact or medical device coatings?
A: When fully cured per recommended thermal schedule (≥130 °C for ≥30 min), residual extractables are below detection limits (<0.1 ppm) in standardized aqueous and ethanol simulants (FDA 21 CFR §175.300 testing protocol).
Q5: Does San-Apro DBU T-AG require special handling or storage conditions?
A: Store in original sealed container at ≤25 °C and <50% RH; avoid prolonged exposure to ambient humidity. No special PPE beyond standard industrial hygiene practices (gloves, safety glasses) is required for routine handling.
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E-mail: wangxingqiang@ericwchem.com
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