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Low-viscosity liquid formulation enables excellent mixing and wetting with epoxy resins.
Fast room-temperature cure profile without requiring elevated post-cure temperatures.
High crosslink density delivers superior chemical resistance and mechanical strength.
Low exotherm during curing enhances safety and dimensional stability for thick-section castings.
Compatible with standard bisphenol-A and bisphenol-F epoxy systems.
Electrical potting and encapsulation of transformers, sensors, and PCBs.
Structural adhesives for aerospace and automotive composite bonding.
High-performance flooring and industrial coatings requiring abrasion resistance.
Wind turbine blade bonding and repair formulations.
Marine-grade protective coatings for hulls and offshore equipment.
| Chemical Type | Amine-based aliphatic polyamine adduct |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, free from sediment or haze |
| Density (25°C) | 0.94–0.97 g/cm³ |
| Viscosity (25°C) | 250–350 mPa·s |
| Amine Value | 220–240 mg KOH/g |
| Reactivity (Gel Time with DGEBA at 25°C) | 60–90 minutes |
| Shelf Life (Unopened, 25°C) | 12 months |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
