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High purity bisphenol A-based epoxy resin with low chloride content for enhanced electrical insulation performance.
Optimized molecular weight distribution ensuring excellent flow, wetting, and adhesion to diverse substrates.
Good thermal stability and compatibility with standard amine and anhydride curing agents.
Low viscosity at elevated processing temperatures, facilitating easy handling and impregnation in composite manufacturing.
Consistent batch-to-batch quality meeting ISO 9001-certified production standards.
Electrical laminates for printed circuit boards (PCBs) and insulating structural components.
High-voltage encapsulation and potting compounds for transformers, sensors, and power electronics.
Prepreg and filament winding resins for aerospace-grade carbon fiber composites.
Adhesives and coatings requiring superior chemical resistance and dimensional stability.
Wind turbine blade bonding and structural reinforcement systems.
| Chemical Type | Bisphenol A epoxy resin (liquid) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of visible particles or gels |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chloride Content | ≤ 700 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, composites, encapsulation, high-performance adhesives |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
