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Highly reactive imidazole derivative enabling rapid epoxy curing at moderate temperatures (80–120 °C).
Excellent latency at room temperature, providing extended pot life for processing and formulation stability.
Low volatility and minimal odor—enhancing workplace safety and compliance with industrial hygiene standards.
Superior compatibility with standard bisphenol-A and novolac epoxy resins without phase separation.
Delivers high glass transition temperature (Tg) and mechanical strength in cured thermosets.
Electronics encapsulation and underfill materials for semiconductor packaging.
High-performance structural adhesives used in aerospace and automotive composites.
Prepregs and laminates for printed circuit board (PCB) substrates requiring low ionic contamination.
Electrically insulating potting compounds for power modules and EV battery components.
Tooling resins and casting systems demanding precise dimensional control and thermal stability.
| Chemical Type | 2-Ethyl-4-methylimidazole derivative (1.2-dimethylimidazole analog) |
| Product Form | Pale yellow to light amber crystalline solid |
| Appearance | Free-flowing granules or fine powder |
| Primary Applications | Epoxy resin curing agent for high-reliability electronic and structural applications |
| Key Features | Latent reactivity, low volatility, high thermal stability, low halogen content |
| Benefits | Improved process safety, reduced outgassing, enhanced Tg, RoHS-compliant formulation support |
| Recommended Loading Range | 3–8 phr (parts per hundred resin), depending on epoxy type and performance requirements |
| Storage Conditions | Store in sealed container at 5–25 °C; protect from moisture and direct sunlight |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
