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Highly efficient latent curing agent for epoxy resins with extended pot life at ambient temperature.
Enables rapid, low-energy thermal curing onset typically between 130–150 °C.
Delivers excellent thermal stability and mechanical strength in cured epoxy networks.
Low volatility and minimal odor—enhancing workplace safety and handling convenience.
Compatible with standard epoxy systems including DGEBA, novolacs, and multifunctional epoxies.
Prepregs and B-staged laminates for high-performance printed circuit boards (PCBs).
Structural adhesives requiring precise process control and high Tg after cure.
Electrical encapsulants and potting compounds for power electronics and sensors.
Carbon fiber reinforced polymer (CFRP) composites in aerospace and automotive components.
Coating systems for corrosion-resistant metal protection and electronic shielding.
| Chemical Type | Imidazole derivative (2-methylimidazole adduct) |
| Product Form | Pale yellow to light amber crystalline solid |
| Appearance | Free-flowing granules or fine powder |
| Melting Point | 65–75 °C (by DSC, onset) |
| Active Content | ≥ 98.0 wt% (as imidazole equivalent) |
| Volatility (105 °C, 2 h) | ≤ 1.0 wt% |
| Primary Applications | Epoxy resin curing for electronics, composites, and adhesives |
| Key Features | Latent, thermally activated, low-dusting, RoHS-compliant |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
