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High thermal stability with extended latency for precise processing control.
Excellent compatibility with standard epoxy curing agents and modifiers.
Low viscosity enabling easy handling, mixing, and impregnation in composite manufacturing.
Superior electrical insulation properties suitable for high-reliability electronic encapsulation.
Consistent batch-to-batch performance meeting stringent quality assurance standards.
Electronics encapsulation for power modules and IGBTs.
High-voltage insulators and bushings in energy transmission systems.
Structural adhesives for aerospace and automotive composites.
Prepreg and filament winding resins for advanced carbon fiber laminates.
Encapsulants for LED packaging requiring thermal and UV resistance.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) based epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, transparent liquid without sediment |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity at 25°C | 10,000–14,000 mPa·s |
| Chloride Content | ≤ 500 ppm |
| Volatility (Loss on Heating at 150°C, 2 h) | ≤ 0.5 wt% |
| Storage Stability | ≥ 12 months at 25°C in sealed container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
