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Highly reactive latent curing agent for epoxy resins, enabling precise control over gel time and cure profile.
Excellent thermal stability with delayed onset of reactivity, supporting extended pot life at room temperature.
Low volatility and minimal odor, enhancing workplace safety and compliance with industrial hygiene standards.
Enables high-gloss, low-shrinkage cured films with superior mechanical strength and chemical resistance.
Compatible with a broad range of diglycidyl ether of bisphenol-A (DGEBA) and novolac epoxy systems.
Electronics encapsulation and underfill materials requiring fine-pitch reliability and low ionic contamination.
Prepregs and laminates for printed circuit board (PCB) manufacturing, especially high-Tg multilayer substrates.
Structural adhesives in aerospace and automotive composites where controlled cure kinetics are critical.
Coating systems for metal substrates demanding rapid through-cure and excellent corrosion resistance.
3D printing resins and advanced composite tooling matrices requiring low-exotherm, high-fidelity curing.
| Chemical Type | 2-Methylimidazole derivative (2-methyl-1H-imidazole, hydrochloride salt) |
| Product Form | White crystalline powder |
| Appearance | Free-flowing white to off-white crystalline solid |
| Primary Applications | Epoxy resin curing agent for electronics, composites, and coatings |
| Key Features | Latent reactivity, low volatility, high thermal latency, excellent dispersion in epoxy |
| Benefits | Extended shelf life, improved processing window, reduced post-cure energy requirements |
| Solubility | Freely soluble in polar solvents (e.g., ethanol, acetone, DMSO); insoluble in hydrocarbons |
| Storage Conditions | Store in original sealed container at 5–25°C, protected from moisture and direct sunlight |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
