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Highly reactive liquid epoxy resin with low viscosity for excellent processability and filler wetting.
Designed for cationic UV-curable systems, enabling rapid, low-energy curing without volatile organic compounds (VOCs).
Superior adhesion to diverse substrates including metals, glass, and plastics under ambient conditions.
Excellent chemical resistance to weak acids, alkalis, and aliphatic solvents after full cure.
Low shrinkage during polymerization, contributing to dimensional stability in precision coatings and encapsulants.
UV-curable protective coatings for electronic components and printed circuit boards (PCBs).
Optical adhesives for lens bonding and display assembly in consumer electronics.
Encapsulants for LED packaging requiring high transparency and thermal reliability.
Overprint varnishes and functional coatings on flexible packaging films.
3D printing resins for high-resolution stereolithography (SLA) applications demanding fine detail and surface hardness.
| Chemical Type | Cationic UV-curable cycloaliphatic epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Homogeneous, transparent liquid at 25°C |
| Viscosity (25°C) | 180–220 mPa·s (cP) |
| Epoxy Equivalent Weight (EEW) | 145–155 g/eq |
| Refractive Index (25°C) | 1.475–1.485 |
| Storage Stability | ≥12 months at 5–25°C in sealed containers, protected from moisture and UV light |
| Primary Applications | UV-curable coatings, adhesives, and encapsulants for electronics and optics |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
