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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent electrical insulation properties, suitable for high-voltage encapsulation applications.
Low viscosity (4,000–6,000 mPa·s at 25°C) enabling superior flow, wetting, and void-free impregnation.
Good thermal stability with glass transition temperature (Tg) exceeding 130°C after full cure.
Low chloride ion content (< 500 ppm), minimizing corrosion risk in sensitive electronic components.
Encapsulation and potting of power electronics, including IGBT modules and EV inverters.
Impregnation of dry-type transformers and high-voltage reactors.
Structural bonding in aerospace composite assemblies requiring elevated thermal performance.
Electrical insulation coatings for busbars and switchgear components.
Matrix resin for filament-wound insulators and hollow-core composite bushings.
| Chemical Type | Bisphenol-F based novolac epoxy resin |
| Product Form | Clear to pale amber viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended matter |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 4,500–5,500 mPa·s |
| Chloride Content | ≤ 400 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | Stable for ≥12 months at ≤25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
