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Low-temperature curing capability enabling efficient epoxy resin crosslinking at ambient to moderate temperatures (20–80°C).
Extended pot life compared to conventional imidazole accelerators, supporting longer processing windows for composite and adhesive formulations.
High thermal stability with decomposition onset above 250°C, contributing to robust final-cured network performance.
Excellent compatibility with standard bisphenol-A and novolac epoxy resins without phase separation or crystallization issues.
Non-volatile and low-odor profile, enhancing workplace safety and compliance with industrial hygiene standards.
Structural adhesives for aerospace and automotive bonding where low-temperature cure and high Tg are critical.
Prepregs and filament-wound composites requiring controlled reactivity and shelf-stable resin systems.
Electrical encapsulants and insulating varnishes for motors, transformers, and power electronics.
Coating systems for metal substrates demanding rapid cure, chemical resistance, and adhesion retention.
3D printing resins (SLA/DLP) where precise thermal latency and post-cure performance are essential.
| Chemical Type | Imidazole derivative (2-ethyl-4-methylimidazole modified) |
| Product Form | Pale yellow to light amber solid granules |
| Appearance | Free-flowing granular powder |
| Primary Applications | Epoxy resin curing agent for structural adhesives, composites, and electrical insulation |
| Key Features | Latent reactivity, low-temperature activation, high thermal stability |
| Benefits | Improved process control, extended shelf life, enhanced cured network toughness |
| Storage Conditions | Store in original sealed container at 5–25°C, protect from moisture and direct sunlight |
| Shelf Life | 24 months under recommended storage conditions |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
