English
Español
tiếng việt
русский
High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and treated plastics without requiring primers.
Low viscosity (350–450 mPa·s at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior thermal stability with glass transition temperature (Tg) up to 120°C after full cure.
Low chloride content (< 500 ppm), ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation of power modules and IGBT substrates.
Structural adhesive formulations for aerospace composite bonding.
High-performance potting compounds for automotive sensors and EV battery components.
Laminating resin for printed circuit board (PCB) prepregs and FR-4 grade materials.
Matrix resin in carbon fiber reinforced polymer (CFRP) wind turbine blade manufacturing.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 350–450 mPa·s |
| Chloride Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
