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High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and treated plastics without requiring primers.
Low viscosity (350–450 mPa·s at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior thermal stability with glass transition temperature (Tg) up to 120°C after full cure.
Low chloride content (< 500 ppm), ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation of power modules and IGBT substrates.
Structural adhesive formulations for aerospace composite bonding.
High-performance potting compounds for automotive sensors and EV battery components.
Laminating resin for printed circuit board (PCB) prepregs and FR-4 grade materials.
Matrix resin in carbon fiber reinforced polymer (CFRP) wind turbine blade manufacturing.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 350–450 mPa·s |
| Chloride Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 25°C in sealed containers |
Q1: What is the primary function of Shikoku C17Z in epoxy formulations?
A: Shikoku C17Z is a reactive diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising final crosslink density or thermal performance.
Q2: Is Shikoku C17Z suitable for high-gloss, low-VOC coating systems?
A: Yes — its low volatility and reactive nature make it well-suited for solvent-free or low-solvent industrial coatings where reduced VOC emissions and good film formation are required.
Q3: How does C17Z compare to non-reactive diluents in terms of mechanical properties?
A: Unlike non-reactive plasticizers or solvents, C17Z participates in the curing reaction, helping retain tensile strength, hardness, and chemical resistance in the cured network — though excessive loading may slightly reduce glass transition temperature.
Q4: Can Shikoku C17Z be used with amine, anhydride, and phenolic hardeners?
A: It demonstrates broad compatibility with common epoxy hardeners including aliphatic and aromatic amines, cyclic anhydrides, and phenolic novolacs, though optimal stoichiometry and cure schedule should be verified per system.
Q5: What handling precautions are recommended for Shikoku C17Z?
A: As with most epoxy compounds, standard industrial hygiene practices apply — use appropriate PPE (gloves, eye protection), ensure adequate ventilation, and avoid prolonged or repeated skin contact to minimize potential sensitization risk.
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