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High-purity sodium hydroxide formulation optimized for consistent developer performance in industrial imaging and photoresist processing.
Controlled particle size distribution ensuring rapid, uniform dissolution and minimal residue formation in aqueous systems.
Stabilized against carbonate formation via nitrogen-blanketed packaging and low-moisture handling protocols.
Non-additive, single-component chemistry—no surfactants, chelators, or organic solvents—to prevent interference with downstream lithography steps.
Trace-metal controlled (Fe < 1 ppm, Ni < 0.5 ppm, Cu < 0.3 ppm) to support high-yield semiconductor and display manufacturing.
Positive-tone photoresist development in TFT-LCD and OLED display panel fabrication.
Microelectronic wafer processing for MEMS and CMOS device patterning.
Printed circuit board (PCB) inner-layer and outer-layer resist development.
Photopolymer plate development in flexographic and letterpress printing plate production.
Specialty film and coating removal in precision optical component cleaning processes.
| Chemical Type | Sodium hydroxide (NaOH), ultra-high purity grade |
| Product Form | White granular solid, free-flowing, non-caking |
| Appearance | White, odorless granules; no visible discoloration or impurities |
| NaOH Purity (by weight) | ≥ 99.99% (ASTM D2168) |
| Moisture Content | ≤ 0.1% (Karl Fischer titration) |
| Primary Applications | Photoresist development, alkaline etch resist stripping, precision cleaning |
| Key Features | Low chloride (< 5 ppm), low sulfate (< 3 ppm), trace-metal certified |
| Regulatory Compliance | REACH compliant; meets SEMI C1–2020 and ISO 9001:2015 manufacturing standards |
| Common Compatible Systems | Suitability |
| TFT Array Coater & Developer Lines (e.g., Tokyo Electron CLEAN TRACK) | Highly Recommended – Fully validated for inline dilution and temperature-controlled delivery |
| PCB Spray Developer Systems (e.g., Orbotech DEVEX series) | Recommended – Requires pre-filtering at 0.5 µm; compatible with stainless-steel wet benches |
| Batch Immersion Resist Developers (e.g., Suss MicroTec MA/BA series) | Suitable – Stable performance at 23–25°C; no tank corrosion observed with 316L SS |
| Automated Flexo Plate Washers (e.g., AVA FlexoClean Pro) | Recommended – Effective for photopolymer relief plate development without swelling artifacts |
Q1: What is the CAS Registry Number for this Sodium Hydroxide Developer?
A: The base compound is sodium hydroxide, CAS No. 1310-73-2. This product carries a proprietary batch-specific certificate of analysis (CoA) confirming identity, purity, and trace-element profile per lot.
Q2: What is the recommended working concentration range for photoresist development?
A: Typical use concentration is 0.1–2.5 wt% NaOH in deionized water (18.2 MΩ·cm), depending on resist type and process speed requirements. Always validate with your specific resist manufacturer’s guidelines.
Q3: How does this developer differ from technical-grade sodium hydroxide?
A: Unlike technical-grade NaOH, this developer is manufactured under cleanroom conditions, certified for trace metals and anions, packaged in moisture-barrier laminated bags with nitrogen purge, and tested for developer activity consistency—not just chemical assay.
Q4: Is there risk of sodium ion migration or leaching into sensitive substrates during development?
A: Migration is negligible under standard process conditions (≤ 60 sec dwell time, rinse within 15 sec). Residual sodium is effectively removed by DI water cascade rinsing and spin-drying; no measurable impact on gate oxide integrity has been observed in qualified 28 nm node processes.
Q5: Does this product meet EU RoHS Directive and US EPA Safer Choice criteria?
A: Yes—it contains no RoHS-restricted substances (Pb, Cd, Hg, Cr⁶⁺, PBB, PBDE) and qualifies as a Safer Choice-eligible ingredient (EPA ID: SC-2023-XXXXX) due to its intrinsic inorganic nature, low ecotoxicity, and absence of VOCs or persistent metabolites.
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E-mail: wangxingqiang@ericwchem.com
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