SYS-9120 Post-Etch Copper Surface Cleaning Solution

Features Of SYS-9120 Post-Etch Copper Surface Cleaning Solution

1. Highly selective removal of post-etch copper residues without attacking underlying copper traces or dielectric layers.

2. Low foaming formulation optimized for high-speed, inline spray and immersion cleaning systems.

3. Non-corrosive to stainless steel, nickel alloys, and common semiconductor tool materials.

4. Water-rinseable with minimal drag-out, supporting low DI water consumption and reduced waste treatment load.

5. Stable performance across a broad temperature range (20–50 °C) and compatible with standard process monitoring controls.

Typical Applications Of SYS-9120 Post-Etch Copper Surface Cleaning Solution

1. Copper interconnect cleaning after chloride-based dry etch in advanced logic and memory device fabrication.

2. Post-etch residue removal in Cu/Low-k BEOL (Back-End-of-Line) processes.

3. Cleaning of copper seed layers prior to barrier deposition or electroplating rework steps.

4. Residue management in 3D IC and fan-out wafer-level packaging (FOWLP) manufacturing lines.

5. Surface preparation for copper-to-copper hybrid bonding applications requiring ultra-low organic and halide contamination.

Specifications Of SYS-9120 Post-Etch Copper Surface Cleaning Solution

Compatible Systems Of SYS-9120 Post-Etch Copper Surface Cleaning Solution

SYS-9120 Post-Etch Copper Surface Cleaning Solution – Frequently Asked Questions (FAQ)

Q1: What is the CAS Registry Number for SYS-9120?

A: SYS-9120 is a proprietary multi-component formulation; individual ingredients are disclosed under confidentiality, and the mixture itself does not carry a single CAS number. Full ingredient disclosure is provided in the Safety Data Sheet (SDS) per regulatory requirements.

Q2: What is the recommended working concentration and dwell time?

A: Typical use concentration is 3–8% v/v in deionized water. Dwell time ranges from 30–120 seconds depending on etch severity and equipment configuration; optimization via Q-time testing is advised for new process integration.

Q3: How does SYS-9120 differ from traditional citric- or glycine-based cleaners?

A: SYS-9120 employs a synergistic chelator system with enhanced selectivity for copper chlorides and oxides, offering faster residue clearance, lower temperature operation, and significantly reduced risk of copper redeposition compared to conventional formulations.

Q4: Does SYS-9120 meet SEMI S2/S8 safety and environmental standards?

A: Yes — SYS-9120 has been assessed per SEMI S2-17A and S8-17A guidelines. It carries a low hazard profile (GHS Category 4 skin irritation, no acute toxicity or environmental hazards), and full compliance documentation is available to qualified customers.

Q5: Is there any risk of extractables or leachables when used with PTFE or FFKM seals?

A: No significant extractables have been observed in qualification testing with PTFE, FFKM (e.g., Kalrez®), or EPDM seals under standard operating conditions. Extractables profiling per USP <87>/<88> and ICH Q5C is available upon request.