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High-performance bisphenol-F based epoxy resin offering superior chemical resistance and thermal stability.
Low viscosity formulation enables excellent wetting and penetration in fiber-reinforced composites.
Excellent adhesion to carbon fiber, glass fiber, and metallic substrates without requiring surface priming.
Optimized for room-temperature and elevated-temperature curing with standard amine or anhydride hardeners.
Low chloride and sodium ion content ensures compatibility with sensitive electronic encapsulation applications.
Aerospace structural composites including primary and secondary load-bearing components.
Wind turbine blade laminates and root joints requiring fatigue resistance and dimensional stability.
High-voltage electrical insulation systems and castings for power transmission equipment.
Marine composite parts exposed to saltwater immersion and UV weathering.
Industrial tooling molds and vacuum-bagged prepreg manufacturing.
| Chemical Type | Bisphenol-F epoxy resin |
| Product Form | Liquid |
| Appearance | Pale yellow to water-white, clear liquid |
| Epoxy Equivalent Weight (EEW) | 180–190 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at 25°C in sealed original container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
