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Ultra-low metallic impurities (≤10 ppt for Fe, Cu, Ni, Cr, Zn, Na, K, Ca, Mg)
Controlled anionic contaminants (SO₄²⁻, NO₃⁻, PO₄³⁻ ≤ 50 ppt each)
Particulate-free formulation (<2 particles/mL @ ≥0.1 µm per ASTM F312-22)
Stable concentration (36–37 wt% HCl) with tight batch-to-batch consistency (±0.1%)
Manufactured and packaged under ISO Class 4 (Class 10) cleanroom conditions
Silicon wafer surface cleaning prior to epitaxy or gate oxide growth
Removal of metal residues (e.g., Al, Ti, W) in post-CMP rinse processes
Etch accelerator and pH adjuster in advanced photoresist stripping solutions
Pre-dip treatment for immersion lithography tools to suppress defect formation
Regeneration of ion-exchange resins used in ultrapure water (UPW) polishing loops
| Chemical Type | Aqueous hydrogen chloride solution |
| Product Form | Liquid (ready-to-use) |
| Appearance | Clear, colorless, fuming liquid |
| Concentration (HCl, wt%) | 36.0–37.0% |
| Density (20 °C) | 1.18–1.19 g/cm³ |
| Primary Applications | Semiconductor front-end wet processing, display TFT fabrication, advanced packaging cleaning |
| Key Features | Low volatility control, low outgassing profile, compatibility with high-purity quartz and fluoropolymer handling systems |
| Regulatory Compliance | REACH compliant; RoHS 2 Directive (2011/65/EU) conformant; no SVHCs above threshold |
| Common Compatible Systems | Suitability |
| SEZ® APEX™ series spin-rinse dryers | Highly Recommended – Validated for sub-28 nm node process compatibility |
| Tokyo Electron (TEL) ACT™ and CLEAN TRACK™ platforms | Highly Recommended – Pre-qualified with TEL’s Material Compatibility Database (v4.2+) |
| Screen Semiconductor (formerly Dainippon Screen) SPRINT™ and UF300™ tools | Recommended – Requires standard quartz-lined chemical delivery configuration |
| Applied Materials (AMAT) Centura® and Producer® wet stations | Suitable – Compatible with PFA, ETFE, and quartz fluidic components; verify pump seal material (FFKM recommended) |
Q1: What is the CAS Number for Electronic Grade Hydrochloric Acid?
A: The CAS Registry Number is 7647-01-0.
Q2: How should this product be handled to minimize extractables during transfer into tool reservoirs?
A: Use only Class 10-certified PFA or high-purity quartz transfer lines; avoid stainless steel contact; pre-wet all fluid paths with ≥2 L of product before process use to reduce system leachables.
Q3: Does this grade meet SEMI C36 (2022) specifications for electronic grade hydrochloric acid?
A: Yes — fully compliant with SEMI C36-1122 for metallic impurities, anions, particles, and packaging integrity requirements.
Q4: Can it be diluted with UPW without compromising purity?
A: Yes — when diluted using ≥18.2 MΩ·cm UPW meeting SEMI F63 standards, dilution does not introduce measurable contamination; however, dilution must occur in a cleanroom environment (ISO Class 5 or better) to prevent particle ingress.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
