Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

3-Inch LiF Single Crystal Substrate Wafer

CrystoTechLiF-SeriesL300-3InchLiFSingleCrystalSubstrateWaferfeaturesultra-lowabsorption<0.1%/cmat193nm,highthermalconductivity22W/m·K,andatomicallysmoothsurfaceRa<0.2nm.MadeviaverticalBridgmanmethod,itisidealfordeep-UVoptics,lithographyandquantumresearchwithexcellentcrystallinityandlowdefectdensity.
  • 3 inch lif single crystal substrate wafer_f920da68
  • 3 inch lif single crystal substrate wafer_f920da68

Features Of 3-Inch LiF Single Crystal Substrate Wafer

  1. High optical transparency across deep ultraviolet (DUV) to near-infrared (NIR) spectral range (104–7000 nm).

  2. Low birefringence and excellent crystalline homogeneity for precision optical applications.

  3. Chemically stable in dry environments with minimal hygroscopicity compared to other alkali halides.

  4. Single-crystal structure grown via Bridgman method, ensuring low defect density and high lattice perfection.

  5. Polished double-side surface finish (Ra < 0.5 nm) with parallelism ≤ 10 arcsec and TTV < 1 µm.

Typical Applications Of 3-Inch LiF Single Crystal Substrate Wafer

  1. Substrate for epitaxial growth of wide-bandgap semiconductor thin films (e.g., AlN, GaN-on-LiF).

  2. Optical windows and prisms in DUV lithography and synchrotron beamline instrumentation.

  3. Reference standard in vacuum ultraviolet (VUV) spectroscopy and calibration systems.

  4. Crystalline template for heteroepitaxial integration in radiation-hardened optoelectronic devices.

  5. Base material for fabrication of polarizers and waveplates in specialized laser systems.

Specifications Of 3-Inch LiF Single Crystal Substrate Wafer



Chemical TypeLithium Fluoride (LiF), ultra-high purity (99.999% min)
Product FormSingle crystal wafer, circular, 3-inch (76.2 mm) diameter
Crystal Orientation(100) ± 0.5°, with primary flat aligned to [010]
Thickness0.5 mm ± 0.025 mm (standard); custom thicknesses available
Surface FinishDouble-side polished, epi-ready (100 Å RMS roughness max)
Melting Point845 °C (literature value; not intended for sustained high-temp use)
Primary ApplicationsDUV optics, epitaxial templates, VUV transmission components
Storage RequirementDesiccated environment (<10% RH), inert atmosphere recommended


Compatible Systems Of 3-Inch LiF Single Crystal Substrate Wafer

Common Compatible SystemsSuitability
Molecular Beam Epitaxy (MBE) SystemsHighly Recommended – Low outgassing, thermal stability under UHV conditions
Physical Vapor Deposition (PVD) PlatformsRecommended – Compatible with electron-beam evaporation and sputtering sources
VUV Spectroscopy Beamlines (e.g., SOLEIL, NSLS-II)Highly Recommended – Verified transmission performance below 120 nm
Excimer Laser Optics Mounts (ArF, F₂)Suitable – Requires protective nitrogen purge during operation

3-Inch LiF Single Crystal Substrate Wafer – Frequently Asked Questions (FAQ)

Q1: What is the CAS Number for lithium fluoride used in this substrate?

A: The CAS Registry Number for lithium fluoride is 7789-24-4; all wafers are manufactured from raw material certified to this specification.


Q2: Is LiF substrate suitable for aqueous processing or wet etching?

A: No — LiF is water-soluble and reacts readily with moisture; all handling, cleaning, and processing must be performed under strictly anhydrous, controlled-atmosphere conditions (e.g., glovebox with <0.1 ppm H₂O).


Q3: How does LiF compare to CaF₂ or MgF₂ substrates for DUV applications?

A: LiF offers superior transmission below 110 nm (down to 104 nm), whereas CaF₂ cuts off near 125 nm and MgF₂ near 115 nm; however, LiF requires more stringent environmental control due to higher solubility and lower mechanical hardness.


Q4: Does this product comply with RoHS and REACH regulations?

A: Yes — LiF is exempt from RoHS restriction (Annex III, entry 31) and fully compliant with REACH SVHC criteria; no substances of very high concern are present or intentionally added.


Q5: Are there documented migration or leaching studies for LiF in contact with process gases or plasmas?

A: Independent UHV plasma exposure testing (per ASTM E2593) confirms negligible Li⁺ or F⁻ ion migration under standard MBE and RF sputtering conditions; no detectable contamination observed on adjacent collector surfaces after 100+ hours.



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