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High purity hexahydrophthalic anhydride (HHPA) with low volatile content for consistent epoxy curing performance.
Excellent thermal stability and low exotherm profile, enabling controlled cure cycles in thick-section composites.
Low viscosity and good miscibility with standard bisphenol-A and novolac epoxy resins.
Superior electrical insulation properties after full cure, meeting IEC 60273 requirements.
Hydrolytically stable structure, offering extended pot life under ambient humidity conditions.
Electrical encapsulation of high-voltage transformers and bushings.
Insulating castings for dry-type power transformers and reactors.
Matrix resin for filament-wound composite pressure vessels and structural components.
Curing agent in aerospace-grade potting compounds requiring low outgassing and high Tg.
High-performance laminates for printed circuit board (PCB) substrates demanding dimensional stability.
| Chemical Type | Hexahydrophthalic anhydride (HHPA), saturated cyclic acid anhydride |
| Product Form | Crystalline solid at room temperature |
| Appearance | White to off-white crystalline powder or granules |
| Melting Point | 135–139 °C (determined by ASTM D2117) |
| Acid Value | 740–760 mg KOH/g (ASTM D4662) |
| Volatility (Loss on Heating at 150°C, 2h) | ≤ 0.3 wt% |
| Moisture Content | ≤ 0.1 wt% (Karl Fischer titration) |
| Key Features | Low color, high thermal resistance, low toxicity profile vs. aromatic anhydrides |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
