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Highly selective etching for aluminum and aluminum alloys with minimal undercutting.
Non-hazardous, non-toxic formulation—free of chromium(VI), hydrofluoric acid (HF), and heavy metals.
Room-temperature operation eliminates need for heating systems or temperature control equipment.
Rapid etch rate (0.5–2.0 µm/min) adjustable via concentration and agitation.
Stable aqueous solution with extended shelf life (>24 months unopened under ambient storage).
Microelectromechanical systems (MEMS) fabrication requiring precise aluminum layer removal.
Printed circuit board (PCB) manufacturing for aluminum-based substrate patterning and via cleaning.
Aerospace component surface preparation prior to anodizing or coating adhesion enhancement.
Optical device manufacturing—including heat sinks, reflector housings, and precision enclosures.
Automotive sensor housing etching and thermal management module texturing.
| Chemical Type | Aqueous alkaline etchant blend (sodium hydroxide–phosphate–complexing agent system) |
| Product Form | Liquid concentrate (ready-to-dilute; typical working dilution: 1:5 to 1:20 in deionized water) |
| Appearance | Clear, colorless to pale yellow liquid |
| pH (neat) | 12.8–13.4 at 25°C |
| Primary Applications | Aluminum (1xxx–7xxx series), Al-Si alloys, Al-Mg alloys |
| Key Features | Controlled isotropic etching, low fume generation, compatible with common photoresists and masks |
| Benefits | Improved process repeatability, reduced wastewater treatment burden, OSHA-compliant handling |
| Regulatory Compliance | REACH compliant; SDS available; not classified as PBT/vPvB; no SVHCs above 0.1% w/w |
| Common Compatible Systems | Suitability |
| Batch immersion tanks (stainless steel 316 or PP-lined) | Highly Recommended – Excellent corrosion resistance; no leaching observed after 12-month exposure |
| Conveyorized spray etching lines | Recommended – Requires filtration <50 µm and periodic pH monitoring |
| Ultrasonic cleaning/etching systems | Suitable – Enhances uniformity on complex geometries; avoid prolonged exposure >5 min per cycle |
| Automated dispensing & recirculation units (with pH/ORP feedback) | Highly Recommended – Enables real-time concentration control and extended bath life |
Q1: What is the CAS Registry Number for this Aluminum Etchant?
A: This is a proprietary multi-component formulation; individual CAS numbers are provided for major constituents in Section 3 of the Safety Data Sheet (SDS). The product itself does not carry a single CAS number.
Q2: What is the recommended working concentration and typical etch time for 10-µm aluminum film?
A: At 1:10 dilution in DI water (25°C, mild air agitation), etch time for 10 µm aluminum is approximately 6–9 minutes. Time may vary ±20% depending on alloy composition and surface condition.
Q3: How does this etchant compare to traditional sodium hydroxide-only solutions?
A: Unlike aggressive NaOH-only etchants, this formulation includes buffering agents and complexing additives that suppress pitting, reduce hydrogen evolution, improve surface finish roughness (Ra < 0.4 µm), and extend bath life by 3–5×.
Q4: Is migration or metal ion extraction into downstream rinse water a concern during use?
A: No significant aluminum ion leaching occurs beyond stoichiometric dissolution. Residual aluminum in final rinse water remains below 0.5 ppm when standard 3-stage counterflow rinsing is applied—well within EPA NPDES discharge limits.
Q5: Does this product meet RoHS Directive 2015/863 and REACH Annex XIV requirements?
A: Yes. The formulation contains zero SVHCs listed in REACH Candidate List (v26, 2024) above threshold, and fully complies with RoHS 2 Annex II maximum concentration values for all restricted substances.
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
