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High-purity imidazole derivative specifically engineered for metal surface passivation and corrosion inhibition.
Excellent thermal and hydrolytic stability under industrial coating and pretreatment process conditions.
Low volatility and low vapor pressure, supporting safe handling in enclosed application systems.
Effective chelation of transition metal ions (e.g., Cu²⁺, Fe³⁺), enhancing anti-tarnish performance on copper and brass substrates.
Compatible with aqueous-based formulations and supports pH buffering in near-neutral ranges (pH 6.5–7.5).
Copper and copper-alloy anti-tarnish treatments in electronics manufacturing (e.g., PCB edge connectors, leadframes).
Corrosion-inhibiting additive in water-based metalworking fluids and cooling lubricants.
Functional component in chromate-free conversion coatings for aluminum and zinc alloys.
Stabilizer in electroless nickel plating baths to suppress spontaneous decomposition.
Additive in protective lacquers and clear coats for architectural copper roofing and façade elements.
| Chemical Type | Imidazole derivative (1H-imidazole, 2-methyl-) |
| Product Form | Pale yellow to off-white crystalline powder |
| Appearance | Free-flowing crystalline solid; no visible impurities |
| Melting Point | 70–74 °C (determined by DSC, 10 °C/min) |
| Assay (by HPLC) | ≥ 98.5% (main peak area relative to standard) |
| Solubility (in water) | Freely soluble (>500 g/L at 20 °C) |
| pH (1% aqueous solution) | 6.8–7.3 (at 25 °C) |
| Regulatory Compliance | REACH registered; compliant with EU RoHS 2015/863 Annex II (no SVHC above threshold) |
| Common Compatible Systems | Suitability |
| Aqueous alkaline cleaning solutions (pH 8.5–10.5) | Highly Recommended – Maintains solubility and functional stability without precipitation |
| Zinc phosphate pretreatment baths | Recommended – Enhances coating weight uniformity and corrosion resistance on steel |
| Water-based acrylic and polyester clear topcoats | Suitable – No adverse interaction with film-forming resins or crosslinkers |
| Electroless copper deposition baths | Highly Recommended – Effective stabilizer against bath decomposition and particle formation |
Q1: What is the CAS Number for BASF Lugalvan IMZ Imidazole?
A: The CAS Number is 693-98-1 (2-Methylimidazole).
Q2: What is the recommended dosage range in copper anti-tarnish dip solutions?
A: Typical concentration is 0.2–1.0 g/L in aqueous dip solutions, optimized based on immersion time, temperature (20–40 °C), and substrate sensitivity.
Q3: How does Lugalvan IMZ compare to benzotriazole (BTA) in migration resistance?
A: Lugalvan IMZ exhibits lower aqueous extractability than BTA under neutral-to-slightly-alkaline rinse conditions, resulting in improved retention on copper surfaces after post-treatment washing.
Q4: Is Lugalvan IMZ approved for use in food-contact applications?
A: It is not authorized under FDA 21 CFR or EU Regulation (EC) No 1935/2004 for direct food-contact surfaces; intended for industrial metal protection only.
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E-mail: wangxingqiang@ericwchem.com
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