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Forms a dense, uniform matte-black conversion coating on copper and copper alloy grids without electrolytic plating.
Room-temperature operation eliminates energy-intensive heating and reduces process cycle time by up to 40%.
Non-cyanide, low-VOC formulation meets stringent occupational health and environmental handling requirements.
Excellent adhesion and abrasion resistance — withstands standard PCB cleaning, solder masking, and thermal cycling (−40 °C to +125 °C).
pH-stable aqueous solution with extended bath life (>6 months under proper maintenance and filtration).
Blackening of copper mesh and grid structures in EMI/RFI shielding gaskets and enclosures.
Surface treatment of copper-based heat sink grids for enhanced infrared emissivity and aesthetic finish.
Pre-treatment of copper foils and grids prior to conformal coating or potting in aerospace sensor assemblies.
Functional blackening of copper current collector grids in battery module interconnects and busbars.
Decorative and functional finishing of copper architectural grilles and HVAC diffuser components.
| Chemical Type | Alkaline copper sulfide conversion chemistry |
| Product Form | Concentrated aqueous liquid (ready-to-dilute) |
| Appearance | Clear to slightly opalescent amber liquid |
| Dilution Ratio | 1:9 to 1:19 (v/v) in deionized water (recommended 1:14) |
| pH (as supplied) | 11.2–11.8 |
| Operating Temperature | 20–30 °C (ambient) |
| Immersion Time | 60–180 seconds (depends on desired film thickness and substrate condition) |
| Regulatory Compliance | REACH SVHC-free; RoHS 3 compliant; OSHA HCS-aligned SDS available |
| Common Compatible Systems | Suitability |
| Standard immersion tanks with polypropylene or PVC lining | Highly Recommended – Chemically resistant and thermally stable at ambient use temperature |
| Conveyorized dip-and-dry lines with stainless steel (316 SS) hardware | Recommended – Requires periodic passivation to prevent iron contamination |
| Ultrasonic cleaning-integrated blackening stations | Suitable – Enhances uniformity on complex grid geometries; verify frequency ≤ 40 kHz |
| Automated dosing and pH control systems (e.g., Metrohm, Endress+Hauser) | Highly Recommended – Enables real-time bath stabilization and predictive maintenance |
Q1: What is the CAS Registry Number for this Copper Grid Blackening Agent?
A: This product is a proprietary multi-component formulation; individual ingredients are disclosed in Section 3 of the Safety Data Sheet (SDS), but the final mixture does not carry a single CAS number per IUPAC and EPA guidelines.
Q2: What is the recommended consumption rate per square meter of copper grid surface?
A: Typical usage is 80–120 mL of concentrate per m² of exposed copper surface (based on 1:14 dilution and 90-second immersion); actual rate varies with grid open area ratio and rinsing efficiency.
Q3: How does this blackening agent differ from traditional copper oxide (CuO) or selenium-based blackening processes?
A: Unlike CuO processes (which require high-temp steam oxidation) or selenium baths (toxic, poor wastewater treatability), this agent forms a controlled CuS/Cu₂S mixed sulfide layer at room temperature with superior IR absorption, lower heavy metal content, and simplified waste neutralization.
Q4: Is extraction testing data available for food-contact or medical device applications?
A: Not applicable — this product is not intended for direct food-contact or implantable medical devices. It is qualified for industrial electronics, aerospace, and architectural applications where ISO 10993 or FDA 21 CFR 175.300 compliance is not required.
Q5: Does the blackened layer migrate or outgas under vacuum or elevated temperature conditions?
A: Independent outgassing testing per ASTM E595 shows TML < 0.10% and CVCM < 0.01% at 125 °C/24h; no measurable migration observed in thermal aging studies up to 150 °C for 1000 hours.
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
